Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates
| Publication | Article in Journal of Electronic Packaging, published March 2012 |
|---|---|
| Authors | C. Y. Khor, M. Z. Abdullah, M. Abdul Mujeebu |
This is the public page for a publication record in Dimensions, a free research insights platform that brings together information about funding, scholarly outputs, policy, patents and grants.
Loading metrics…