Adhesive Strength and Diffusion at Interfaces between Sintered Cu Layer and Metal Surfaces (Cu, Ag, Au, Pd, Pt, Ni, NiPx, and NiBx)
Publication | Article published April 2023 |
---|---|
Authors | Dai Ishikawa, Hideo Nakako, Thomas Blank, Helge Wurst, Felix Steiner |
This is the public page for a publication record in Dimensions, a free research insights platform that brings together information about funding, scholarly outputs, policy, patents and grants.
Loading metrics…